Orthopaedic implant removal using high frequency vibration
This project has been secured to protect intellectual property.
Login for More InformationDesign a device that utilizes ultrasonic vibrations to match the resonance frequency of PMMA in order to easily extract a hip implant during surgery.
Project Overview
In total hip arthroplasties requiring orthopaedic implants, complications arise when the hip implant remains in the body for an extended time. Despite a 90% success rate for THAs, an implant can cause bone overgrowth after some time. The current implant removal process involves extensive damage to the bone due to the drilling, chiseling, and other destructive methods used which cause bone loss. Both patients and physicians would benefit from less aggressive removal techniques. This team worked to find a solution to develop an orthopaedic implant removal device by using high-frequency vibrations to break apart the cement used to keep the implant secured to the bone, therefore, loosening the metal implant.
Team Picture

Contact Information
Team Members
- Guillemette Schroepfer - Team Leader & BPAG
- Grace Boswell - Communicator
- Rayona Kinny - BSAC
- Elle Thom - BWIG
Advisor and Client
- Prof. John Puccinelli - Advisor
- Dr. Jeffrey Henstenburg - Client
Related Projects
- Spring 2025: Orthopaedic implant removal using high frequency vibration
- Fall 2024: Orthopaedic implant removal using high frequency vibration