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Orthopaedic implant removal using high frequency vibration

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Design a device that utilizes ultrasonic vibrations to match the resonance frequency of PMMA in order to easily extract a hip implant during surgery.

Project Overview

In total hip arthroplasties requiring orthopaedic implants, complications arise when the hip implant remains in the body for an extended time. Despite a 90% success rate for THAs, an implant can cause bone overgrowth after some time. The current implant removal process involves extensive damage to the bone due to the drilling, chiseling, and other destructive methods used which cause bone loss. Both patients and physicians would benefit from less aggressive removal techniques. This team worked to find a solution to develop an orthopaedic implant removal device by using high-frequency vibrations to break apart the cement used to keep the implant secured to the bone, therefore, loosening the metal implant.

Team Picture

Team photo: Guillemette Schroepfer, Rayona Kinny, Elleana Thom and Grace Boswell.
Team photo: Guillemette Schroepfer, Rayona Kinny, Elleana Thom and Grace Boswell.

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Team Members

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